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Brand Name : XTKCONN
Model Number : Wafer housing terminal
Certification : CE,SGS,ROHS,ISO9001
Place of Origin : Guangdong,China
MOQ : 500pcs
Price : Negotiable price
Payment Terms : L/C, T/T,Payyal
Supply Ability : 3KK pcs
Delivery Time : 5-7 days
Packaging Details : inner package:in reel; Outer Package: reel in Carton
Rated Voltage : 250V
Plating : Tin Plating
Pitch : 1.25mm
Rated current : 1.0A
Withstand Voltage : 500V AC/minute
Service : OEM/ODM
8pin 1.25mm pitch Wafer Box Connector DIP 180 Degree wire to board connector
Product Description
According to the spacing, it can be roughly divided into 2.54mm, 2.00mm, 1.27mm, 1.00mm, and 0.8mm. There are single row pins, double row pins, and three rows of pins according to the number of rows. According to the package usage, there are patches SMT (bed stickers). / vertical stickers), plug-in DIP (inline / bend), etc.; according to the installation method: 180 ° with S, 90 ° with W, SMT with T.
Current Rating | 2.0 AMP |
Contact Resistance | 20 mΩ Max |
Withstand Voltage | 500 V AC/DC |
Insulation Resistance | 1000MΩ Min |
Operation Temperature | -40℃ to 105℃ |
Contact Material | Coppy Alloy |
Products Name | Female Header Connector |
Pitch | 2.00mm(0.079'') |
Mounting Type | Through Hole |
Contact Plating | Au over Ni |
Insulator Material | PA6T+30%GF(UL94V-0) |
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1.25mm Pitch Wafer Box Connector DIP 180 Degree 8 Pin Wire To Board Connector Images |